Cost-efficient and reliable glue tape lamination of chip module tapes
Permanent fixation of a chip module is crucial for every smart card to meet the different demands of ID cards, banking cards, GSM /SIM cards, and dual interface cards. The GTL700 is a highly reliable and flexible solution for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The glue tape is laminated onto the backside of the module tape. To accommodate the chip, holes are punched into the glue tape prior to lamination.
The system operates stand-alone or inline, and is suitable for a wide range of IC module tapes. Various punching and laminating tools are available, which can be exchanged with a few simple steps. Optional reel units allow use of an additional protection tape and separation of carrier tape.