Efficient solutions for profitable smart card production
Smart cards are the fastest growing segment of the card industry. Whether effective access control, secure financial transactions, public transport, or enhanced identification documents, smart cards will provide better security and greater ease of use.
ruhlamat offers the most technically advanced solutions for smart card production with a product portfolio that meets your needs now and in the future. Years of hands-on experience in designing, manufacturing and supporting smart card solutions have provided us the tools to create proven technology. Whether you are looking for a machine for cavity milling, chip module implanting, milling & implanting, or glue tape lamination, we have everything you need for efficient and economical production.
All systems are flexible and can also be configured for dual interface card production. Our innovative solutions provide highest accuracy and ensure highly reliable, durable smart cards. Flawless card production with highest quality and yield is guaranteed by automatic inline quality control and testing.
Cavity Milling System
High-speed cavity milling for more productivity. The modular and very efficient PowerMill is designed for the production of high quality smart cards in a very economical way. Available with various options, the system adjusts flexibly to any requirements for milling of cavities and/or antenna connection pads.
Chip Module Implanting System
The PowerImplant enables high-speed chip module implanting for the cost-efficient production of high quality contact and dual interface cards.
This innovative solution provides highest accuracy and ensures a stable, long-lasting connection between chip module and card body, and between dual interface IC module and antenna.
Milling & Implanting System
The PowerCombi combines high-speed cavity milling and implanting of chip modules on a single machine. This modular and very efficient all-in-solution is designed for medium to high volume production and is capable to automatically finish contact and dual interface cards in one production run.
Various options are available: Checking of card orientation, card thickness, cavity depth, antenna continuity and module quality.
Glue Tape Lamination System
The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process.
The very efficient system can operate stand-alone or inline, and is suitable for a wide range of IC module tapes (contact, contactless, and dual interface).