application 
•  e-passport, contactless cards, dual interface cards (DIF) 
•  antenna inlay production using wire embedding and 
    thermocompression bonding or soldering technology

description 
•  reel to reel or reel to sheet system
•  manual loading/unloading of sheets 
•  vacuum table 
•  multiple wire embedding heads 
•  thermocompression or soldering units

benefits & features
•  modular system to be upgraded with embedding heads
•  special software tool "easy create" for programming customised
    antenna layouts
•  automated intermetallic bonding process


The machine is suitable for automatic punching of modules out of 35mm tape and placing modules onto defined positions on the table. The layout of wire coil is programmable using a special software tool; coated wires will be automatically embedded into substrate using ultrasonic method. The electrical connection between wire and module pads is done by thermocompression bonding or soldering method using high temperature and defined pressure which results in a reliable inter metallic connection.

Patent situation

The wire embedding technology based on certain methods and devices is legally protected by third party patents for the following families in special countries:

chip card family
winding head family
wire conductor family

We accept those rights and will not deliver methods & devices in these countries!