application 
•  IC module production / automatic encapsulation of (wire) bonded  
    chips on module tape incl. UV curing and measuring control on
    module tape

description 
•  automatic feeding of module tape (35mm) from reel
•  preparation system for globe top material
•  12-head dispensing unit(s)
•  curing of globe top material by UV radiation
•  module height control, inline
•  automatic reeling on module tape

benefits & features
•  high throughput / high accuracy dispensing
•  dam & fill process, modular machine design
•  programmable movement of dosing heads
•  programmable dispensing parameters
•  heating of module tape & dosing heads
•  process control visualisation
•  UV curing incl. intensity control system
•  100% height measurement
•  additional globe top form inspection
•  process data capture / statistics
•  graphic display with teach-in function
•  module tape splicer