GTL700 - Glue Tape Lamination System
Cost-efficient and reliable glue tape lamination of chip module tapes
Permanent fixation of a chip module is crucial for every smart card to meet the different demands of ID cards, banking cards, GSM /SIM cards, and dual interface cards. The GTL700 is a highly reliable and flexible solution for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The glue tape is laminated onto the backside of the module tape. To accommodate the chip, holes are punched into the glue tape prior to lamination.
The system operates stand-alone or inline, and is suitable for a wide range of IC module tapes. Various punching and laminating tools are available, which can be exchanged with a few simple steps. Optional reel units allow use of an additional protection tape and separation of carrier tape.
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Features
- Integrated spooling system for 35 mm module tape, protective foil, and glue tape
- Optional reel units for additional protection tape and separation of carrier tape
- End of tape check and tension control
- Laminating unit with temperature, time and pressure control
- 6-fold and 10-fold punching and laminating tools
- Punching and laminating tools also for dual interface IC modules
- Exchange tool sets for easy and quick change to other IC module types
- Alert system stops machine if module tape, glue tape or additional protection tape is running out
Advantages
- Highest yield, maximum machine uptime and short product changeover times lead to very low cost of ownership
- Up to 8,000 chip modules/hour
- High flexibility for all IC module types and sizes, including dual interface
- Adjustable lamination temperature, time and pressure ensure maximum compatibility with a wide variety of glue tape suppliers
- Multi-hole punching tools and punch waste container
- In-house tool manufacturing, customized punching tool designs on request
- Stand-alone system or integration into production line
- Small footprint
- Best price-performance ratio
Applications
Glue tape lamination of chip module tapes for smart cards such as secure ID cards, banking cards, GSM / SIM cards, and dual interface cards.
