Chip Module Production

Market-leading, innovative systems at affordable prices

The smart card market is characterised by strong competition and falling prices for components. This requires a higher level of automation and increased efficiency, without compromising quality and precision. Face these mounting challenges head-on with innovative machines and systems designed by ruhlamat to perform in the most demanding production environments.

Our affordable and industry-proven machine solutions provide the speed, quality and economy that will help you to sustain and maximise profitability in the future. We offer sophisticated, high-quality machines for the chip module production, ranging from encapsulation, testing and encoding of IC modules to glue tape lamination of module tapes.

PowerSeal - Chip Module Encapsulation Machine

Encapsulation is the method for protecting the chip and wires against mechanical stress and environmental influences. For this purpose, cast resin is dispensed and then cured by UV light or heat, depending on the type of resin.

PowerTest - Chip Module Test System

The inspection of IC modules for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance.

GTL700 - Glue Tape Lamination System

The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process.

Your contact person:

Christian Tipecska

COO

Head of Sales

+49 36925 929300

c.tipecska@ruhlamat.de

Do you have any questions or would you like us to send you an offer? Then simply send us your request!

Open
contact form