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Chipkartenprozesstechnik
Montagetechnik
Service
MS130-2 combi

application
•  automatic milling of cavity in smart card according ISO 7816 
    combined with automatic chip module implanting into cavities of
    card bodies
•  automatic punching out modules from reel and transfer system
•  telephone cards, dual interface cards (DIF), GSM cards, ID cards, 
    etc. 

description 
•  card input module 
•  NC milling head; easy create software
•  cleaning station; cavity depth control system
•  unwinding station for chip module tape
•  chip module punching station
•  chip module implanting system
•  tacking and hot/cold press unit
•  card output module

benefits & features

•  combines optimum proportion of standardizing with highest level of
    individuality by upgradeable customized design, modular system
•  magazine capacity 500 cards, card orientation check
•  automatic card thickness control
•  antenna recognition system with functionality test (DIF)
•  different gluing methods for implanting chip modules possible
•  comfortable windows based operator software for easy handling
•  assure highest level of quality standards
•  tele diagnostic service

 linie
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Application & Details 
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