application 
•  e-passport, contactless cards, dual interface cards (DIF) 
•  automatic antenna inlay production using wire embedding and 
    thermocompression bonding technology

description 
•  manual loading/unloading of sheets 
•  vacuum table 
•  multiple wire embedding heads 
•  thermocompression unit

benefits & features
•  modular system to be upgraded with embedding heads
•  special software tool "easy create" for programming customised 
   antenna layouts
•  automated intermetallic bonding process


The machine is suitable for automatic punching of modules out of 35mm tape and placing modules onto defined positions on the table. The layout of wire coil is programmable using a special software tool; coated wires will be automatically embedded into substrate using ultrasonic method. The electrical connection between wire and module pads is done by thermo compression bonding method using high temperature and defined pressure which results in a reliable inter metallic connection. The operator will feed sheet(s) and remove manufactured inlay system manually.

The traditional ultrasonic wire embedding method is described below:



Picture by courtesy of EUGEN G. LEUTZE Verlag, D-88348 Bad Saulgau “Handbuch der Leiterplattentechnik”, 1. Auflage 1982
Translation by ruhlamat^®